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  Datasheet File OCR Text:
 Advance Product Information
SIMMIC 50-860 MHz FREQUENCY UPCONVERTER
FEATURES
* 50-860 MHz RF FREQUENCY RANGE * 50-1800 MHz LO RANGE * 15 dB VARIABLE GAIN RF AMP * +5 dB dBm IIP3 MIXER * 8 dB RF CONVERSION GAIN * BUFFERED LO OUTPUT
Mixer (OUT2) VCC (AMP) GND (AMP) Mixer (OUT1) BIAS CKT VCC(IF) VCC VCC LO (OUT) LO Bypass VCC OSC (E) OSC (B)
UPC2799
INTERNAL BLOCK DIAGRAM
RF(IN)
DESCRIPTION AND APPLICATIONS
The UHF Band frequency converter is manufactured using the (FT 20 GHz) NESAT III process . This 5V IC consists of a RF Gain control amplifier, linear, Gilbert cell mixer, two stages of LO buffering, local oscillator, external filter port, and a temperature compensation circuit. This device was specifically designed for CATV, Modems, HFC Telephony and other Multimedia applications. NEC's stringent quality assurance and test procedures assure the highest reliability and performance.
GND(IF) VAGC Bypass GND(IF) IFIN
GND(LO) IF(OUT)
ELECTRICAL CHARACTERISTICS (TA = 25C)
PARAMETERS Supply Voltage Current MIXER SECTION Input Return Loss RF Input Frequency LO Frequency Gain Flatness Noise Figure 750MHz Input IP3 Conv. Gain MIXER RLIN RF LO GF NF IIP3 GC 6 MHz Measured at mixer output Measured at mixer output 8 dB +3 +5 .25 12 w/external match 50 10 860 1800 dB MHz MHz dB dB dBm SYMBOLS VCC ICC CONDITIONS MIN 4.5 TYP 5 41 MAX 5.5 UNITS V mA
*The information contained in this document is being issued in advance of the production cycle for the device. The parameters for the device may change before final production or NEC Corporation, at its own discretion, may withdraw the device prior to its production.
California Eastern Laboratories
ELECTRICAL CHARACTERISTICS (TA = 25C)
PARAMETERS LO SECTION LO Tuning Range SSB Phase Noise LO Spurious RF to LO ISOL LO to RF Leak LO to IF Leak LO Buffered Output RF AMPLIFIER SECTION RFINPUTRL RF Bandwidth RF Flatness RF Gain Range Output IP3 Noise Figure Min Gain Max Gain Input RL RFBW dB 6 MHz BW w/ external match 45 -0.3 3 +15 6.0 7.0 10 900 +0.3 15 dB MHz dB dB dBm dB RF-LO LO-RF LO-IF 40 LO 10 KHz offset 700 800 -85 -40 -50 -45 -20 -15 MHz dBc/Hz dBc dBm dBm dBm dBm SYMBOLS CONDITIONS MIN TYP MAX UNITS
*Dependent on external tuning circuit (1) Indicate whether specification is for internal use only.
OUTLINE DIMENSIONS (Units in mm)
PACKAGE OUTLINE 20 PIN SSOP
20 11
PIN CONNECTIONS
1 2 3 4 5 20 19 18 17 16 15 14 13 12 11
N
1
7.00 MAX
10 6.40.2 4.40.1 1.0
6 7 8
1.5 0.1 1.8 MAX +0.10 0.22 - 0.05
+0.10 0.15 - 0.05
0.50.2 0.65 0.575 MAX
9 10
Lead Material: Alloy 42 Lead Plating: Lead Tin Alloy\\
PIN CONNECTIONS: 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. Mixer (Out1) Mixer (Out 2) Vcc (AMP) GND(AMP) RF (IN) GND (IF) VAGC Bypass GND (IF) IF (IN) 20. VCC (IF) 19. VCC 18. VCC 17. LO OUT 16. LO(B) 15. VCC 14.OSC (E) 13. OCS (B) 12. GND (LO) 11. IF (OUT)
2/5/97


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